A thermal model was constructed to simulate the combined heat transfer phenomena, including thermal radiation in the heating chamber, during the sputtering process. The changes in thermal characteristics when thermal radiation occurred within the chamber system were analyzed using CFD (Computational Fluid Dynamics) method. The research emphasis in this paper was to explore the temperature distribution on the large glass panel. In order to achieve the temperature uniformity criterion (±15°C), the chamber design was improved to prevent a significant difference between temperature distributions. Several design factors were made to observe the effect on temperature distribution. After optimizing the chamber structure, the IR heater settings were in the end determined to meet the standards of three different sputtering circumstances.
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ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences
August 10–14, 2008
Jacksonville, Florida, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4849-4
PROCEEDINGS PAPER
A Study on the Optimal Design of Heating Chamber in Sputtering Process for Large-Sized LCD Panel Manufacturing Available to Purchase
Bin Hu,
Bin Hu
University of Kansas, Lawrence, KS; Korean University of Technology and Education, Cheon-an, Chungnam, South Korea
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Kwang-Sun Kim,
Kwang-Sun Kim
Korea University of Technology and Education, Cheon-an, Chungnam, South Korea
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Ik-Tae Im,
Ik-Tae Im
Iksan National College, Iksan, South Korea
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Byung-Han Yun
Byung-Han Yun
AVACO, Co., Ltd., Daegu, South Korea
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Bin Hu
University of Kansas, Lawrence, KS; Korean University of Technology and Education, Cheon-an, Chungnam, South Korea
Kwang-Sun Kim
Korea University of Technology and Education, Cheon-an, Chungnam, South Korea
Ik-Tae Im
Iksan National College, Iksan, South Korea
Byung-Han Yun
AVACO, Co., Ltd., Daegu, South Korea
Paper No:
HT2008-56081, pp. 503-510; 8 pages
Published Online:
July 7, 2009
Citation
Hu, B, Kim, K, Im, I, & Yun, B. "A Study on the Optimal Design of Heating Chamber in Sputtering Process for Large-Sized LCD Panel Manufacturing." Proceedings of the ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. Heat Transfer: Volume 3. Jacksonville, Florida, USA. August 10–14, 2008. pp. 503-510. ASME. https://doi.org/10.1115/HT2008-56081
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