The thermal management system of a commercially available notebook computer is investigated by using a commercial finite volume Computational Fluid Dynamics (CFD) software. After taking the computer apart, all dimensions are measured and all major components are modeled as accurately as possible. Heat dissipation values and some characteristics of the components are obtained from the manufacturer’s specifications. Different heat dissipation paths utilized in the design are investigated. Two active fans and aluminum heat dissipation plates as well as the heat pipe system are modeled according to their exact specifications. Under different operating powers, adequacy of the existing thermal management system is observed. Average temperatures of the sides of the casing, the keyboard and the internal components are reported in the form of tables. Thermal resistance networks for five different operating conditions are obtained from the analysis of the CFD simulation results.

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