The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM n-ecosane with melting temperature Tm = 36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A (2D) mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum and energy transport were developed and discretised by using the volume control approach. The resulting algebraic equations were next solved iteratively by using TDMA algorithm. Numerical investigations were conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameters of the heat sink that maximize the time required by the base of the electronic component to reach a critical temperature.

Volume Subject Area:
Heat Transfer in Electronic Equipment
Keywords:
Protruding electronic component, phase change material, latent heat storage, passive cooling
Topics:
Cooling, Electronic components, Heat sinks, Numerical analysis, Phase change materials
This content is only available via PDF.
You do not currently have access to this content.