Quantitative measurement of channel wall temperature in two-phase microchannel flows using infrared thermography is discussed. In particular, the top channel wall temperature of a branching microchannel silicon heat sink is presented. Quantitative temperature measurements require several considerations in the design and fabrication of the heat sink and test facility, in calibration, and in data analysis; each of these are discussed. Temperature measurements, with a spatial resolution of 10 μm, are presented over an 18 mm × 18 mm area of the heat sink during flow boiling.
- Heat Transfer Division
Local Wall Temperature Measurements in Microchannel Flow Boiling Using Infrared Thermography
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Krebs, D, Narayanan, V, Liburdy, J, & Pence, D. "Local Wall Temperature Measurements in Microchannel Flow Boiling Using Infrared Thermography." Proceedings of the ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. Heat Transfer: Volume 2. Jacksonville, Florida, USA. August 10–14, 2008. pp. 435-445. ASME. https://doi.org/10.1115/HT2008-56253
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