In semiconductor manufacturing process, very accurate temperature control is required. In this work we studied precise temperature control methods for a simple model by numerical simulation. To minimize temperature change at an object position of a vertical plate with varying a noise-heat-generation, we calculated unsteady temperature change of the plate under the effect of a feedback control and a feed-forward control of a control-heater. The temperature change at the object position can be decreased 1/10 times (0.7°C) using the feedback control of 2 s monitoring-time-step with the control-heater placed between the object position and the noise-heat-generation position. The temperature change at the object position can be decreased 1/1000 times (0.001°C) using the feed-forward control of 2 s monitoring-time-step and 5 s forecasting-time with the control-heater placed between the noise-heat-generation position and the object position.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4276-2
PROCEEDINGS PAPER
Analytical Study of Thermal Control Method to Minimize Temperature Change of a Plate With Changing Heat Generation
Shigeki Hirasawa,
Shigeki Hirasawa
Kobe University, Kobe, Hyogo, Japan
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Shinya Ito
Shinya Ito
Kobe University, Kobe, Hyogo, Japan
Search for other works by this author on:
Shigeki Hirasawa
Kobe University, Kobe, Hyogo, Japan
Shinya Ito
Kobe University, Kobe, Hyogo, Japan
Paper No:
HT2007-32609, pp. 169-173; 5 pages
Published Online:
August 24, 2009
Citation
Hirasawa, S, & Ito, S. "Analytical Study of Thermal Control Method to Minimize Temperature Change of a Plate With Changing Heat Generation." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 169-173. ASME. https://doi.org/10.1115/HT2007-32609
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