This paper presents the flow and heat transfer characteristics in a cross-linked silicon microchannel heat sink. The heat sink is composed of 45 channels, 270 μm wide × 285 μm tall in a silicon substrate formed via deep reactive ion etching. A detailed discussion of the pressure drop data reduction is described, including characterization of the channel cross-sections and methods to account for inlet and exit loss coefficients. No significant difference is observed in the pressure drop measurements between the cross-linked and standard heat sinks flowing air and water. The use of un-encapsulated liquid crystal thermography was successfully utilized to obtain local heat transfer data with FC-72 as the working fluid. The heat transfer results show inflections in the thermal profile due to the cross-links.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4275-4
PROCEEDINGS PAPER
Thermo-Fluidic Characteristics in a Cross-Linked Silicon Microchannel Heat Sink
R. Muwanga,
R. Muwanga
Concordia University, Montreal, QC, Canada
Search for other works by this author on:
I. Hassan
I. Hassan
Concordia University, Montreal, QC, Canada
Search for other works by this author on:
R. Muwanga
Concordia University, Montreal, QC, Canada
I. Hassan
Concordia University, Montreal, QC, Canada
Paper No:
HT2007-32290, pp. 969-978; 10 pages
Published Online:
August 24, 2009
Citation
Muwanga, R, & Hassan, I. "Thermo-Fluidic Characteristics in a Cross-Linked Silicon Microchannel Heat Sink." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 969-978. ASME. https://doi.org/10.1115/HT2007-32290
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