The research for this paper was focused on novel design, fabrication, and characterization about a micro capillary pumped loop (Micro-CPL) evaporator chamber. Ribs or nozzle diffuser have been employed in this chamber, those structures prevented back flow and ensured rapid spreading of cooling liquid in the evaporator chamber. Experimental results had demonstrated that a greatest flow velocity of 206.9 mm/s could be obtained at a situation for rib width was 5 μm and aspect ratio was 15. Spreading time was increased gradually as increase at the depth of the rib. On the other hand, nozzle-diffuser structure yields smoother and faster liquid spreading in the chamber than that of rib structures. The minimum rib width with 2 μm by DRIE could carry out a back pressure of 55 kPa, hence, it was large enough for micro CPL application.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4275-4
PROCEEDINGS PAPER
The Fabrication of the Micro-Capillary-Pumped-Loop Available to Purchase
Chao-Yang Huang,
Chao-Yang Huang
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
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Shih-Wun Wang,
Shih-Wun Wang
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
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Hung-Wen Lin,
Hung-Wen Lin
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
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Wei-Keng Lin
Wei-Keng Lin
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
Search for other works by this author on:
Chao-Yang Huang
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
Shih-Wun Wang
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
Hung-Wen Lin
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
Wei-Keng Lin
National Tsing-Hua University, Hsinchu, Taiwan, R.O.C.
Paper No:
HT2007-32254, pp. 963-968; 6 pages
Published Online:
August 24, 2009
Citation
Huang, C, Wang, S, Lin, H, & Lin, W. "The Fabrication of the Micro-Capillary-Pumped-Loop." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 963-968. ASME. https://doi.org/10.1115/HT2007-32254
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