We here present the results of an effort to determine the influence of the parameters affecting cold-plate performance and to minimize the total thermal resistance of a CPU cold-plate. An analysis based on analytical calculations and CFD simulations shows that spreading resistance is affected not only by the heat source area, cold-plate thickness and thermal conductivity of the cold-plate material, but also by the effective heat transfer coefficient of the interface between cold-plate and cooling liquid. Different options for optimizing heat transfer through the cold-plate are discussed.

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