Various techniques have been proposed to improve heat transfer efficiency for CPU chip cooling under steady-state conditions. To account for temperature variations as well as save energy and reduce the noise from the cooling fan, numerous active control schemes for CPU chip cooling have been investigated. The objective of this paper is to construct dynamic models of an active cooling device used for CPU chip cooling using computational fluid dynamics (CFD) approach. The dynamic models will be used to design controllers to achieve active chip cooling. The constructed dynamic model has two inputs, the heat flux generated by the chip and the cooling fan pressure. The output is the temperature of the case housing the chip. The results from the dynamic model constructed based on the frequency responses agrees well with those from the time domain CFD simulation.
- Heat Transfer Division
Construction of Dynamic Models for an Air-Cooled CPU Chip Cooling Device
Zhang, R, Zhang, C, & Jiang, J. "Construction of Dynamic Models for an Air-Cooled CPU Chip Cooling Device." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 699-703. ASME. https://doi.org/10.1115/HT2007-32930
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