This paper documents the geometric optimization of a three dimensional micro-channel heat sink with hydraulic diameter greater than 10μm. Two methods of analysis were used to perform the optimization; approximate relation using scale analysis and numerical method using a finite volume code. The micro-channel heat sink is treated as a combined unit. The effect of void fraction and pressure drop on the aspect ratio, hydraulic diameter and peak temperature on the micro-channel heat sink were investigated. The numerical simulation was carried out on a unit cell with volume of 0.9 mm3 and pressure differences between 10 kPa and 75 kPa. The optimal configurations obtained numerically were compared with those obtained from approximate relationship using scale analysis and the trends are found to be in good agreement.
Skip Nav Destination
ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4275-4
PROCEEDINGS PAPER
Combined Micro-Channel Heat Sink Optimization for Cooled Electronics Available to Purchase
Tunde Bello-Ochende,
Tunde Bello-Ochende
University of Pretoria, Pretoria, South Africa
Search for other works by this author on:
Josua P. Meyer
Josua P. Meyer
University of Pretoria, Pretoria, South Africa
Search for other works by this author on:
Tunde Bello-Ochende
University of Pretoria, Pretoria, South Africa
Josua P. Meyer
University of Pretoria, Pretoria, South Africa
Paper No:
HT2007-32049, pp. 661-669; 9 pages
Published Online:
August 24, 2009
Citation
Bello-Ochende, T, & Meyer, JP. "Combined Micro-Channel Heat Sink Optimization for Cooled Electronics." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 661-669. ASME. https://doi.org/10.1115/HT2007-32049
Download citation file:
8
Views
Related Proceedings Papers
Related Articles
Free Convection Limits for Pin-Fin Cooling
J. Heat Transfer (August,1998)
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets
J. Electron. Packag (March,2006)
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
The Latest Hot CD
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Outlook
Closed-Cycle Gas Turbines: Operating Experience and Future Potential