The behavior of rewetting on high superheated surface, focusing on rewetting temperature during collapse of saturated and subcooled film boiling was investigated experimentally and analytically. Saturated and subcooled film-boiling experiments were conducted by using a Silicon wafer with 20 mm length, 20 mm width and 0.5 mm thickness and pure water at atmospheric condition. Both pool boiling and impingement jet experiments were preformed in the present study. Then, the present experimental results were examined by using hydrodynamics instability on liquid-vapor interface (Rayleigth-Tayor instability) and a heat conduction model (rewetting model under a falling-flow of a liquid layer).
- Heat Transfer Division
Study on Behavior of Rewetting on Hot Wall
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Ohtake, H, Koizumi, Y, Kobayashi, S, & Watanabe, T. "Study on Behavior of Rewetting on Hot Wall." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 555-559. ASME. https://doi.org/10.1115/HT2007-32860
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