Nanostructured electronic and photonic devices include a high density of material interfaces, which can strongly impede heat conduction and influence performance and reliability. Thermal conduction through interfaces is a very mature field as long as the interface dimensions are large compared to the phonon wavelength. In nanostructures, however, the confinement of phonons in the directions parallel to the interface may strongly influence heat conduction. The present work investigates a model problem consisting of an abrupt junction between a harmonic 1D and 2D square lattice. The results show that energy couples to phonon modes localized near the free surface and that the energy transmission coefficient across the interface into these surface modes is less than unity even for materials with identical bulk impedances. The lattice dynamics calculations performed here provide an initial perspective on the impact of phonon confinement on the acoustic mismatch resistance and lay the groundwork for more detailed studies involving 3D molecular dynamics.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4275-4
PROCEEDINGS PAPER
Thermal Interface Resistances in Nanostructures Available to Purchase
Matthew Panzer,
Matthew Panzer
Stanford University, Stanford, CA
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Ken Goodson
Ken Goodson
Stanford University, Stanford, CA
Search for other works by this author on:
Matthew Panzer
Stanford University, Stanford, CA
Ken Goodson
Stanford University, Stanford, CA
Paper No:
HT2007-32412, pp. 499-508; 10 pages
Published Online:
August 24, 2009
Citation
Panzer, M, & Goodson, K. "Thermal Interface Resistances in Nanostructures." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 499-508. ASME. https://doi.org/10.1115/HT2007-32412
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