The computational study investigates different pin fin arrangements at low Reynolds numbers, which would typically be prevalent in mini-micro-channels used in enhancing heat as well as mass transfer. The effect of pin density, span-wise pitch, and stream-wise pitch is investigated on friction and heat transfer over a range 5<ReD<400. High density pins with small span-wise pitches were found to provide the highest augmentation in heat transfer capacity (conductance), whereas low density pins with or without a large stream-wise pitch were found to provide the least heat transfer benefits in the low Reynolds number range studied. Friction factor decreases considerably as the pin density decreases. The effect of decreasing span-wise pitch increases the friction factor in the low Reynolds number regime (ReD<200) but decreases it beyond ReD = 200 by delaying wake instabilities and the associated increase in form drag. Increasing the stream-wise pitch decreases the friction factor at low ReD<200, but increases it at ReD>200 due to the formation of larger recirculating wakes. Overall it is concluded that a high density arrangement with a small span-wise pitch provides the best thermal performance.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4275-4
PROCEEDINGS PAPER
Thermal Performance of Pin Fins at Low Reynolds Numbers in Mini-Micro-Channels Available to Purchase
N. E. Blackwell
N. E. Blackwell
U. S. Army RDECOM, Fort Belvoir, VA
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A. Rozati
Virginia Tech, Blacksburg, VA
D. K. Tafti
Virginia Tech, Blacksburg, VA
N. E. Blackwell
U. S. Army RDECOM, Fort Belvoir, VA
Paper No:
HT2007-32158, pp. 121-129; 9 pages
Published Online:
August 24, 2009
Citation
Rozati, A, Tafti, DK, & Blackwell, NE. "Thermal Performance of Pin Fins at Low Reynolds Numbers in Mini-Micro-Channels." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 121-129. ASME. https://doi.org/10.1115/HT2007-32158
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