Experimental measurement of thermal conductivity is considered the most reliable tool for the study of phonon transport in ultra-thin silicon structures. While there has been a great success in thermal conductivity measurement of ultra-thin silicon layers down to 20 nm over the past decade, it is not clear if the existing techniques and tools can be extended to the measurements of sun 100 Angstrom layers. In this paper, an analytical study of the feasibility of electrical Joule heating and thermometry in patterned metal bridges is presented. It is concluded that thermal conductivity of silicon layers as thin as 5 nm can be obtained (uncertainty 20%) by performing steady-state measurements using an on-substrate nanoheater structure. The thermal characterization of silicon layers as thin as 1 nm may be possible using frequency domain measurements.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4274-6
PROCEEDINGS PAPER
Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers Available to Purchase
Keivan Etessam-Yazdani,
Keivan Etessam-Yazdani
Carnegie Mellon University, Pittsburg, PA
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Mehdi Asheghi
Mehdi Asheghi
iCONA Technology, Palo Alto, CA
Search for other works by this author on:
Keivan Etessam-Yazdani
Carnegie Mellon University, Pittsburg, PA
Mehdi Asheghi
iCONA Technology, Palo Alto, CA
Paper No:
HT2007-32904, pp. 937-941; 5 pages
Published Online:
August 24, 2009
Citation
Etessam-Yazdani, K, & Asheghi, M. "Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 937-941. ASME. https://doi.org/10.1115/HT2007-32904
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