An experimental set up is developed to deliver monodisperse microdroplets at different volumetric flows over a hot surface. In-house built circuitry activates a Thermal Ink Jet (TIJ) atomizer to spray controlled amounts of deionized water to cool a small area of 5 mm by 3 mm on a copper block. The temperature history is monitored through K-type thermocouples and the dissipated power is calculated using Fourier’s law. Digital cameras are used to track the wetted area unveiling considerable changes in the wetted area present close to the CHF. The controlled flow delivery and small droplets (50 μm diameter) result in small wetted areas near the CHF. The wetted area is measured and used to compute the dissipated heat. Experimental results show dissipation of heat fluxes up to 4 kW/cm2 based on the best estimate of the wetted area.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4274-6
PROCEEDINGS PAPER
High Power Density Dissipations by Spray Cooling
Sergio Escobar,
Sergio Escobar
Hewlett-Packard and Santa Clara University, Santa Clara, CA
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Ratnesh Sharma,
Ratnesh Sharma
Hewlett-Packard, Palo Alto, CA
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Drazen Fabris,
Drazen Fabris
Santa Clara University, Santa Clara, CA
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Jorge E. Gonzalez,
Jorge E. Gonzalez
Santa Clara University, Santa Clara, CA
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Cullen Bash
Cullen Bash
Hewlett-Packard, Palo Alto, CA
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Sergio Escobar
Hewlett-Packard and Santa Clara University, Santa Clara, CA
Ratnesh Sharma
Hewlett-Packard, Palo Alto, CA
Drazen Fabris
Santa Clara University, Santa Clara, CA
Jorge E. Gonzalez
Santa Clara University, Santa Clara, CA
Cullen Bash
Hewlett-Packard, Palo Alto, CA
Paper No:
HT2007-32442, pp. 791-795; 5 pages
Published Online:
August 24, 2009
Citation
Escobar, S, Sharma, R, Fabris, D, Gonzalez, JE, & Bash, C. "High Power Density Dissipations by Spray Cooling." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 791-795. ASME. https://doi.org/10.1115/HT2007-32442
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