The performance and reliability of the GMR heads are adversely affected by self-heating due to the aggressive scaling of its dimensions to increase areal density. In this manuscript, the self-heating of the GMR head during the normal operation is investigated. An analytical model is developed to estimate the temperature rise in the GMR sensor due to self-heating for magnetic recording areal densities from 2.8 to 80 Gbits/in2, which agrees well with the FEM simulations. This model is subsequently used to investigate the influence of the GMR head constituent materials’ thermal properties on the device temperature rise. A 3-D finite element analysis was also performed to predict the level of self-heating in lead-overlaid (LOL) design, which agrees well with the experimental data obtained using steady-state and transient measurements. This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Self-Heating Modeling of Magnetic Recording Read Head Available to Purchase
Y. Yang,
Y. Yang
Carnegie Mellon University, Pittsburgh, PA
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M. Asheghi
M. Asheghi
Carnegie Mellon University, Pittsburgh, PA
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Y. Yang
Carnegie Mellon University, Pittsburgh, PA
L. Baril
Maxtor Corporation, Milpitas, CA
E. Schreck
Maxtor Corporation, Milpitas, CA
A. Wallash
Maxtor Corporation, Milpitas, CA
M. Asheghi
Carnegie Mellon University, Pittsburgh, PA
Paper No:
HT2005-72681, pp. 845-851; 7 pages
Published Online:
March 9, 2009
Citation
Yang, Y, Baril, L, Schreck, E, Wallash, A, & Asheghi, M. "Self-Heating Modeling of Magnetic Recording Read Head." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 845-851. ASME. https://doi.org/10.1115/HT2005-72681
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