Heat transport rates of micro scale SEMOS (Self-Exciting Mode Oscillating) heat pipe with inner diameter of 1.5mm, 1.2mm and 0.9mm, were investigated by using R141b, ethanol and water as working fluids. The effects of inner diameter, liquid volume faction, and material properties of the working fluids are examined. It shows that the smaller the inner diameter, the higher the thermal transport density is. For removing high heat flux, the water is the most promising working fluid as it has the largest critical heat transfer rate and the widest operating range among the three kinds of working fluids. A one-dimensional numerical simulation is carried out to describe the heat transport characteristics and the two-phase flow behavior in the closed loop SEMOS heat pipe. The numerical prediction agrees with the experimental results fairly well, when the input heat through was not very high and the flow pattern was slug flow. This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Heat Transport Characteristics in Closed Loop Oscillating Heat Pipes Available to Purchase
Shuangfeng Wang,
Shuangfeng Wang
University of Tokyo, Tokyo, Japan
Search for other works by this author on:
Shigefumi Nishio
Shigefumi Nishio
University of Tokyo, Tokyo, Japan
Search for other works by this author on:
Shuangfeng Wang
University of Tokyo, Tokyo, Japan
Shigefumi Nishio
University of Tokyo, Tokyo, Japan
Paper No:
HT2005-72273, pp. 805-810; 6 pages
Published Online:
March 9, 2009
Citation
Wang, S, & Nishio, S. "Heat Transport Characteristics in Closed Loop Oscillating Heat Pipes." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 805-810. ASME. https://doi.org/10.1115/HT2005-72273
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