In this study, forced cooling of heat sinks mounted on CPUs was investigated. Heat sink effectiveness, effect of turbulence models, effect of radiation heat transfer and different heat sink geometries were numerically analyzed by commercially available computational fluid dynamics softwares Icepak and Fluent. The numerical results were compared with the experimental data and they were in good agreement. Conjugate heat transfer is simulated for all the electronic cards and packages by solving Navier-Stokes equations. Grid independent, well converged and well posed models were run and the results were compared. The best heat sink geometry is selected and it is modified in order to have lower maximum temperature distribution in the heat sink. This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
CFD Analyses of Heat Sinks for CPU Cooling With Fluent
Emre O¨ztu¨rk,
Emre O¨ztu¨rk
Anova CAD-CAE-TEST, Ankara, Turkey
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I˙lker Tarı
I˙lker Tarı
Middle East Technical University, Ankara, Turkey
Search for other works by this author on:
Emre O¨ztu¨rk
Anova CAD-CAE-TEST, Ankara, Turkey
I˙lker Tarı
Middle East Technical University, Ankara, Turkey
Paper No:
HT2005-72778, pp. 763-771; 9 pages
Published Online:
March 9, 2009
Citation
O¨ztu¨rk, E, & Tarı, I. "CFD Analyses of Heat Sinks for CPU Cooling With Fluent." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 763-771. ASME. https://doi.org/10.1115/HT2005-72778
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