A parallel plate heat sink is optimized using a model based on the volume average theory (VAT). VAT is briefly developed and the numerical scheme is described. The numerical simulation is carried out in FORTRAN. The resulting VAT solutions are verified by comparison to experimental results via a Nusselt number correlation. The procedure for optimization is described and, as an example, a heat sink of a size appropriate for cooling a CPU is optimized for minimum thermal resistance, maximum effectiveness, and maximum heat transfer rate per unit volume. Seven parameters are included in the simulations: fin thickness, fin length, fin height, fin pitch to thickness ratio, base width, base thickness, and pore Reynold’s number. Three are chosen for optimization: fin height, fin pitch, and pore Reynolds number. The responses are optimized for an aluminum heat sink.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Optimization of a Parallel Plate Heat Sink Using Volume Averaging Theory Available to Purchase
Benjamin A. Blake,
Benjamin A. Blake
University of California at Los Angeles, Los Angeles, CA
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Ivan Catton
Ivan Catton
University of California at Los Angeles, Los Angeles, CA
Search for other works by this author on:
Benjamin A. Blake
University of California at Los Angeles, Los Angeles, CA
Ivan Catton
University of California at Los Angeles, Los Angeles, CA
Paper No:
HT2005-72237, pp. 695-702; 8 pages
Published Online:
March 9, 2009
Citation
Blake, BA, & Catton, I. "Optimization of a Parallel Plate Heat Sink Using Volume Averaging Theory." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 695-702. ASME. https://doi.org/10.1115/HT2005-72237
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