In this paper the variable conductance heat transfer in a flat plate thermosyphon has been considered. For this purpose the governing equations including mass and momentum conservation laws are solved numerically. It should be noted that liquid-film momentum advection, axial normal stress and interfacial shear stress were typically included and shown to be important to the thermosyphon performance. It is found that total system pressure and mean vapor temperature at different concentrations of mixture are nearly constant for a special range of absorbed power in evaporator. The obtained numerical results are in good agreement with available experimental data.
Volume Subject Area:
Heat Transfer in Electronic Equipment
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