In the present work, deionized water is impinged onto a heated silicon surface using square arrays of round jets. Various numbers of jets and jet diameters are used over a heated area of constant size with the orifice plate height above the heater held constant. In these experiments, the jet orifices are sharp-edged and the fluid exhaust direction is parallel to the heated surface and leaves the chip periphery through a manifold. The resulting temperature and flow data are presented in physical units as well as in groups of dimensionless parameters. A correlation is presented to reasonably predict the experimental results of this study. The techniques used for data reduction and for experimentation, including the construction of the test module, are given in detail, including a numerical conduction simulation based data reduction technique and uncertainty analysis. The results shown include flow rates ranging from 6.1 cc/s to 63.18 cc/s resulting in Reynolds numbers based on orifice diameter ranging from 141 to 6670. Jet diameters investigated in this study range from 377 μm to 1.01 mm, in square arrays of 16 to 324 orifices on an area of 18.52 mm × 18.59 mm. The resulting maximum spatially averaged effective heat transfer coefficient achieved is 7.94 W/cm2K, and the maximum spatially averaged Nusselt number based on jet diameter is 79.4.
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Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface
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Campbell, LA, Ellsworth, MJ, Jr., Iyengar, M, Simons, R, & Chu, R. "Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 629-636. ASME. https://doi.org/10.1115/HT2005-72397
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