A series of experimental investigations with a stringent measurement method on the natural heat transfer from an unconfined or confined smooth and extended surface have been successfully conducted. From the results, the maximum transient-/steady-state local Nusselt number exists in the region near the edge of the heated smooth or extended surface, and the transient-/ steady-state local Nusselt number decreases along the distance from the surface edge toward the surface center. The transient-/steady-state local and average Nusselt number increases with increasing Grs, H/W or Hes/W. The effects of Grs, H/W and Hes/W on the Nus/Nus,o distribution are not significant; and the Nus/Nus,o distribution can be expressed as a generalized bowl-shaped profile, which is independent of Grs, H/W and Hes/W. By the statistical sensitivity analysis of ANOVA F-test, the steady-state average Nusselt number for unconfined/confined smooth or extended surface is significantly affected by either one of Grs, H/W and Hes/W. Among them, Grs has the most significant effect. Four new correlations of steady-state average Nusselt number in terms of relevant influencing parameters for unconfined/ confined smooth or extended surfaces are proposed, respectively. Furthermore, two normalized steady-state average Nusselt numbers for confined smooth or extended surfaces are proposed, respectively. As compared with the steady-state average Nusselt numbers for unconfined/confined smooth surface, the steady-state heat transfer enhancement for unconfined/confined extended surface can be achieved between 93.99% and 254.65%.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Natural Convective Heat Transfer From an Unconfined or a Confined Heated Surface
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Liu, LK, Lin, TW, Wu, MC, Peng, CH, & Hung, YH. "Natural Convective Heat Transfer From an Unconfined or a Confined Heated Surface." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 591-598. ASME. https://doi.org/10.1115/HT2005-72157
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