This paper presents a study of liquid jet impingement cooling technique and its system level implementation for thermal management of an inverter module in a hybrid vehicle. Clusters of anti-freeze liquid jet array impinge on the base plate of a 450V (DC Link voltage)/400A (RMS current) module, made by Semikron, Inc. In the harsh environment of an automobile, the ambient temperature of the coolant is 105°C, and the maximum allowable flow rate and pressure drop are 2.5GPM and 1.6bar respectively. The impingement cooling technique demonstrates 1623 Watts of heat dissipation for 20°C device temperature rise above ambient. This translates to a chip level dissipation power density of 56W/cm2, approximately 1.8X improvement over forced convection liquid cooling in the state-of-the-art pin fin cold plate. At the highest power, the less than 3°C temperature variation among the twelve IGBT measurements indicates a high degree of reliability in module operation. The efficient phase change heat transfer mechanism sets in at local base plate temperatures between 109–111°C, which accounts for more than 10% of the total heat dissipation at 1600W level.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Jet Impingement Cooling of an Inverter Module in the Harsh Environment of a Hybrid Vehicle
Bhunia, A, & Chen, C. "Jet Impingement Cooling of an Inverter Module in the Harsh Environment of a Hybrid Vehicle." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 561-567. ASME. https://doi.org/10.1115/HT2005-72574
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