The CPL is a high efficiency two-phase heat transfer device using the phase change of working fluid to transport heat from evaporator to condenser; it is a cyclic circulation pumped by capillary force. Since CPL does not need any other mechanical force such as pump, it might be used to do the thermal management of high power electronic component on spacecraft. This study presents a novel CPL with a semi-arc porous evaporator in 1U server on the ground with a horizontal position and scale down the whole device to the miniature size (range from mm to cm). This miniature-CPL is made of aluminum with the shape of evaporator and the porous structure using a semi-arc instead of square and cylinder structure. Testing results show that the miniature-CPL could remove heat 45W in steady state and keep the heat source temperature about 73°C.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Experiment of a Novel Capillary-Pumped Loop With a Semi-Arc Porous Evaporator in 1U Simulation Cabinet Available to Purchase
Hung-Wen Lin,
Hung-Wen Lin
National Tsing Hua University, Hsin-Chu, Taiwan
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Ming-Chieh Wu,
Ming-Chieh Wu
National Tsing Hua University, Hsin-Chu, Taiwan
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Wei-Keng Lin
Wei-Keng Lin
National Tsing-Hua University, Hsin-Chu, Taiwan
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Hung-Wen Lin
National Tsing Hua University, Hsin-Chu, Taiwan
Ming-Chieh Wu
National Tsing Hua University, Hsin-Chu, Taiwan
Wei-Keng Lin
National Tsing-Hua University, Hsin-Chu, Taiwan
Paper No:
HT2005-72380, pp. 543-547; 5 pages
Published Online:
March 9, 2009
Citation
Lin, H, Wu, M, & Lin, W. "Experiment of a Novel Capillary-Pumped Loop With a Semi-Arc Porous Evaporator in 1U Simulation Cabinet." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 543-547. ASME. https://doi.org/10.1115/HT2005-72380
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