Efficiency of synthetic jet impingement cooling and the mechanisms of heat removal from a constant heat flux surface were investigated experimentally. The effects of jet’s formation frequency and Reynolds number at different nozzle-to-surface distances were investigated and compared to steady jet cooling. It was found that synthetic jets are up to three times more effective than steady jets at the same Reynolds number. For smaller distances, high formation frequency (f = 1200 Hz) synthetic jets remove heat better than low frequency (f = 420 Hz) jets, whereas low frequency jets are more effective at larger distances, with an overlapping region. Using PIV, it was shown that at small distances between the synthetic jet and the heated surface, the higher formation frequency jet is associated with accumulation of vortices before they impinge on the surface. For the lower frequency jet, the wavelength between coherent structures is so large that vortex rings impinge on the surface separately.
ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Electronic Cooling Using Synthetic Jets
Anna A. Pavlova
,
Anna A. Pavlova
Rensselaer Polytechnic Institute, Troy, NY
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Michael Amitay
Michael Amitay
Rensselaer Polytechnic Institute, Troy, NY
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Author Information
Anna A. Pavlova
Rensselaer Polytechnic Institute, Troy, NY
Michael Amitay
Rensselaer Polytechnic Institute, Troy, NY
Paper No:
HT2005-72110, pp. 493-501; 9 pages
Published Online:
March 9, 2009
Citation
Pavlova, Anna A., and Amitay, Michael. "Electronic Cooling Using Synthetic Jets." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 493-501. ASME. https://doi.org/10.1115/HT2005-72110
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