A fin-and-tube evaporator of a commercially available air conditioning unit was studied experimentally. To this end a test rig was constructed to measure the heat transfer capacity on the air and waterside of the evaporator. A wide range of Reynolds numbers on the air airside was investigated, focusing on the low Reynolds numbers, as modern air conditioning systems mainly operate in this region (low sound levels). The resulting data was used to determine the convective heat transfer correlation (expressed using the Colburn factor) and the friction factor on the airside. This evaporator was chosen for the fin type: an adaptation of the standard inclined louvered type. The found correlation is compared to the one published for standard louvered fins. A thorough error analysis was performed to validate the results.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Heat Transfer and Friction Characteristics of an Adapted Inclined Louvered Fin Available to Purchase
Christophe T’Joen,
Christophe T’Joen
Ghent University, Gent, Belgium
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Michel De Paepe,
Michel De Paepe
Ghent University, Gent, Belgium
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Hendrik-Jan Steeman,
Hendrik-Jan Steeman
Ghent University, Gent, Belgium
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Arnout Willockx
Arnout Willockx
Ghent University, Gent, Belgium
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Christophe T’Joen
Ghent University, Gent, Belgium
Michel De Paepe
Ghent University, Gent, Belgium
Hendrik-Jan Steeman
Ghent University, Gent, Belgium
Arnout Willockx
Ghent University, Gent, Belgium
Paper No:
HT2005-72417, pp. 389-396; 8 pages
Published Online:
March 9, 2009
Citation
T’Joen, C, De Paepe, M, Steeman, H, & Willockx, A. "Heat Transfer and Friction Characteristics of an Adapted Inclined Louvered Fin." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 389-396. ASME. https://doi.org/10.1115/HT2005-72417
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