This paper describes a study of milli-Kelvin (mK) level temperature measurement and modeling. It describes the instrumentation for mK temperature measurement and an analysis and quantification of the measurement uncertainty. It also explains the development of an analytical model and simulation of a significant portion of the laboratory equipment configuration. Finally, it provides a comparison and correlation of the laboratory and predicted results for change in temperature. Results show very good agreement and demonstrate the capability for precision temperature measurement technique described in this paper.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Precision Thermal Modeling and Measurement
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Pytel, D, & Hashemi, A. "Precision Thermal Modeling and Measurement." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 151-162. ASME. https://doi.org/10.1115/HT2005-72815
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