The paper presents a precise numerical simulation of the transport processes in a rectangular cavity saturated with a water-ethanol mixture. The full transient Navier-Stokes equations coupled with the heat and mass transfer equations are solved by the means of the finite volume method. The mixture properties are drawn from the recent work by Dutrieux et al. [1]. The density is assumed to vary linearly with temperature and concentration (Boussinesq approximation) in the working temperature range while other thermo physical properties are held constant. After validation the present code is used for a series of numerical experiments. Thermodiffusion in a liquid-mixture of Ethanol and Water is analyzed under zero gravity condition. Different thermal boundary conditions scenarios are considered to simulate possible thermal control system shortcomings. Results of investigations might help in the preparation and monitoring of the heat sources control systems during the direct Soret coefficient measurement experiments.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Convection-Free Thermodiffusion in a Water-Ethanol Mixture Subject to Varying Thermal Boundary Conditions
M. Chacha,
M. Chacha
United Arab Emirates University, Al Ain, UAE
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M. Z. Saghir
M. Z. Saghir
Ryerson University, Toronto, ON, Canada
Search for other works by this author on:
M. Chacha
United Arab Emirates University, Al Ain, UAE
M. Z. Saghir
Ryerson University, Toronto, ON, Canada
Paper No:
HT2005-72664, pp. 865-872; 8 pages
Published Online:
March 9, 2009
Citation
Chacha, M, & Saghir, MZ. "Convection-Free Thermodiffusion in a Water-Ethanol Mixture Subject to Varying Thermal Boundary Conditions." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 865-872. ASME. https://doi.org/10.1115/HT2005-72664
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