An hp finite element-based model has been developed to calculate heat, mass, and momentum transfer within rooms and building interiors. The hp-adaptive methodology is based on both mesh enrichment (h-adaptation) and spectral order incensement (p-adaptation) in an effort to produce accurate results with the least computational cost. A Lagrangian Particle Transport (LPT) technique is coupled with the adaptive scheme to simulate mass transport. The model is particularly amenable for depicting the transport of contaminants associated with indoor air quality. The hp-adaptive algorithm is validated using natural convection in a square enclosure. The model is subsequently applied to the simulation of momentum, heat, and mass transport within building interiors: air and temperature distribution patterns are presented along with potential pathways of a powder dispersing within an office.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Simulation of Heat, Mass, and Momentum Transfer Within Building Interiors Available to Purchase
Xiuling Wang,
Xiuling Wang
University of Nevada at Las Vegas, Las Vegas, NV
Search for other works by this author on:
Darrell W. Pepper
Darrell W. Pepper
University of Nevada at Las Vegas, Las Vegas, NV
Search for other works by this author on:
Xiuling Wang
University of Nevada at Las Vegas, Las Vegas, NV
Darrell W. Pepper
University of Nevada at Las Vegas, Las Vegas, NV
Paper No:
HT2005-72639, pp. 859-864; 6 pages
Published Online:
March 9, 2009
Citation
Wang, X, & Pepper, DW. "Simulation of Heat, Mass, and Momentum Transfer Within Building Interiors." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 859-864. ASME. https://doi.org/10.1115/HT2005-72639
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