In this paper, convective heat transfer for fully developed laminar flow in a pin fins array using a two-dimensional periodic model of porous structure has been studied. A macroscopically uniform flow is assumed to pass through an array of circular pin fins placed regularly in an infinite space. Due to periodicity of the model, only one structural unit is taken for a calculation domain to resolve an entire domain of pin fins array. In the structural unit, pin fins surface are maintained at constant temperature, and Continuity, Navier-Stokes and energy equations are solved numerically to describe the microscopic velocity and temperature fields at a pore scale. The numerical results thus obtained are integrated over the structural unit to evaluate the dimensionless macroscopic pressure gradient and the thermal diffusivity tensors. Finally, the obtained results compared with available numerical and experimental data.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Analysis of Convective Heat Transfer for Laminar Flow in a Pin Fins Array Available to Purchase
H. Shokouhmand,
H. Shokouhmand
University of Tehran, Tehran, Iran
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M. Moghari
M. Moghari
University of Tehran, Tehran, Iran
Search for other works by this author on:
H. Shokouhmand
University of Tehran, Tehran, Iran
M. Moghari
University of Tehran, Tehran, Iran
Paper No:
HT2005-72739, pp. 711-720; 10 pages
Published Online:
March 9, 2009
Citation
Shokouhmand, H, & Moghari, M. "Analysis of Convective Heat Transfer for Laminar Flow in a Pin Fins Array." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 711-720. ASME. https://doi.org/10.1115/HT2005-72739
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