This work presents a Lagrangian approach to simulate convective heat transfer in small scales. The fully developed flow field, simulated by a Lattice Boltzmann Method, is combined with Lagrangian tracking of thermal markers to determine the behavior of an instantaneous scalar line source located at the wall of a channel. The resulting probability density functions are used to calculate the behavior of continuous line sources of heat at the wall of the channel, as well as the temperature for the case of constant temperature or constant heat flux from the wall. This method is resourceful in terms of computational efficiency, in that it can be used to simulate various thermal boundary conditions and Prandtl number fluids with a single flow field resulting from a Lattice Boltzmann simulation.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Simulation of Heat Transfer With LBM and Lagrangian Methods for Microfluidic Applications
Nishitha Thummala,
Nishitha Thummala
University of Oklahoma, Norman, OK
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Dimitrios V. Papavassiliou
Dimitrios V. Papavassiliou
University of Oklahoma, Norman, OK
Search for other works by this author on:
Nishitha Thummala
University of Oklahoma, Norman, OK
Dimitrios V. Papavassiliou
University of Oklahoma, Norman, OK
Paper No:
HT2005-72313, pp. 563-570; 8 pages
Published Online:
March 9, 2009
Citation
Thummala, N, & Papavassiliou, DV. "Simulation of Heat Transfer With LBM and Lagrangian Methods for Microfluidic Applications." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 563-570. ASME. https://doi.org/10.1115/HT2005-72313
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