Heat transfer enhancement is a subject of major concern in numerous fields of industry and research. Having received undivided attention over the years, it is still studied worldwide. Given the exponential growth of computing power, large-scale numerical simulations are growing steadily more realistic, and it is now possible to obtain accurate time-dependent solutions with far fewer preliminary assumptions about the problems. As a result, an increasingly wide range of physics is now open for exploration. More specifically, it is time to take full advantage of large eddy simulation technique so as to describe heat transfer in staggered parallel-plate flows. In fact, from simple theory through experimental results, it has been demonstrated that surface interruption enhances heat transfer. Staggered parallel-plate geometries are of great potential interest, and yet many numerical works dedicated to them have been tarnished by excessively simple assumptions. That is to say, numerical simulations have generally hypothesized lengthwise periodicity, even though flows are not periodic; moreover, the LES technique has not been employed with sufficient frequency. Actually, our primary objective is to analyze turbulent influence with regard to heat transfers in staggered parallel-plate fin geometries. In order to do so, we have developed a LES code, and numerical results are compared with regard to several grid mesh resolutions. We have focused mainly upon identification of turbulent structures and their role in heat transfer enhancement. Another key point involves the distinct roles of boundary restart and the vortex shedding mechanism on heat transfer and friction factor.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Large Eddy Simulations of Staggered Parallel-Plate Flows
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Pham, MV, Plourde, F, & Doan, SK. "Large Eddy Simulations of Staggered Parallel-Plate Flows." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 451-458. ASME. https://doi.org/10.1115/HT2005-72102
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