An experimental study was conducted to demonstrate the existence and estimate the value of an optimum number density of silicon plates (blocks) in a fluidic self-assembly process used for parallel assembling of microelectronics. Blocks ranging in size from 350 to 1050 microns were released under water over an inclined substrate and allowed to move gravitationally to fill indentations (receptors) of matching shape. The performance of the process was evaluated in terms of the time necessary to achieve filling. Results indicate that there is an optimum block density for which the filling time is minimum. If the density is too high, blocks in contact with each other form agglomerations that reduce the mobility of individual blocks and prevent them from aligning properly with the receptors to fill them. The optimum area fraction covered by blocks was relatively similar for the three sizes of blocks considered. The findings amend a common belief that the FSA performance increases indefinitely with the density of blocks released. Economic advantages of a limited block density at industrial scale are discussed.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Optimum Number Density of Blocks Released in Fluidic Self-Assembly of Microelectronics
Adriana Brasoava,
Adriana Brasoava
North Dakota State University, Fargo, ND
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Radu Danescu,
Radu Danescu
North Dakota State University, Fargo, ND
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David Wells,
David Wells
North Dakota State University, Fargo, ND
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Nayan Reddy
Nayan Reddy
North Dakota State University, Fargo, ND
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Adriana Brasoava
North Dakota State University, Fargo, ND
Radu Danescu
North Dakota State University, Fargo, ND
David Wells
North Dakota State University, Fargo, ND
Nayan Reddy
North Dakota State University, Fargo, ND
Paper No:
HT2005-72768, pp. 419-423; 5 pages
Published Online:
March 9, 2009
Citation
Brasoava, A, Danescu, R, Wells, D, & Reddy, N. "Optimum Number Density of Blocks Released in Fluidic Self-Assembly of Microelectronics." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 419-423. ASME. https://doi.org/10.1115/HT2005-72768
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