In this paper, we studied the effect of thermal diffusion (Soret effect), the heat flux due to species concentration gradient (Dufour effect) and the heat by chemical reactions in a chemical vapor deposition (CVD) process used to hermetically coat optical fibers. Using a previously developed mass and heat transfer model to investigate the transport phenomena in this process, the Soret and Dufour effects are compared to ordinary mass diffusion. The thermal conductivity, molecular diffusivity and thermal diffusivity are calculated using a multi-component model. The contribution of heat of chemical reactions to overall heat transfer in the CVD is also discussed. Soret effect and heat by chemical reactions are found to be very important in this process, and their effect is related to operating conditions such as draw speed and optical fiber inlet temperature.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Soret, Dufour and Heat by Chemical Reaction Effects in a Chemical Vapor Deposition Optical Fiber Coating Process Available to Purchase
Wei Huang,
Wei Huang
University of Connecticut, Storrs, CT
Search for other works by this author on:
Wilson K. S. Chiu
Wilson K. S. Chiu
University of Connecticut, Storrs, CT
Search for other works by this author on:
Wei Huang
University of Connecticut, Storrs, CT
Wilson K. S. Chiu
University of Connecticut, Storrs, CT
Paper No:
HT2005-72520, pp. 393-397; 5 pages
Published Online:
March 9, 2009
Citation
Huang, W, & Chiu, WKS. "Soret, Dufour and Heat by Chemical Reaction Effects in a Chemical Vapor Deposition Optical Fiber Coating Process." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 393-397. ASME. https://doi.org/10.1115/HT2005-72520
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