This study presents a model to predict the directional and hemispherical emittance of a fiber coated with up to 2 μm film. The fiber is composed of semitransparent media with a small extinction coefficient. Transmittance and reflectance of the thin film is calculated based on the flat thin film assumption, because the thickness of the film is much less than the fiber radius, and the curvature can be neglected. Predicted emittance from wave optics is compared to geometric optics for modeling radiative transfer in thin film. Steep changes in emittance are predicted by wave optics for films that are nanometers thick. This effect was not observed from geometric optics analysis. Effects of film and fiber substrate optical properties are also studied.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Hemispherical Emittance of a Semitransparent Fiber Coated With a Submicron Absorbing Film Available to Purchase
Weixue Tian,
Weixue Tian
University of Connecticut, Storrs, CT
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Wei Huang,
Wei Huang
University of Connecticut, Storrs, CT
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Wilson K. S. Chiu
Wilson K. S. Chiu
University of Connecticut, Storrs, CT
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Weixue Tian
University of Connecticut, Storrs, CT
Wei Huang
University of Connecticut, Storrs, CT
Wilson K. S. Chiu
University of Connecticut, Storrs, CT
Paper No:
HT2005-72519, pp. 385-391; 7 pages
Published Online:
March 9, 2009
Citation
Tian, W, Huang, W, & Chiu, WKS. "Hemispherical Emittance of a Semitransparent Fiber Coated With a Submicron Absorbing Film." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 385-391. ASME. https://doi.org/10.1115/HT2005-72519
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