Models are presented for the determination of thermal conductivity of a composite lamina with woven fiber mats. In analyzing the cure cycle of a composite part, the common practice has been to use weight-averaged thermal properties. The limitation of this approach becomes apparent when one finds that thermal conductivity calculated for fiberglass/epoxy composite is very close to thermal conductivity of carbon/epoxy composite. This happens for composite parts with the same fiber volume fraction. In weight-average formulations the effect of fiber thermal conductivity is overshadowed by the density of the constituents. To overcome this problem, one needs to take another approach. In this investigation finite element analysis is performed to determine thermal conductivities of fiberglass/epoxy and carbon/epoxy composite lamina. The resulting thermal conductivities are different for the two composite types. These results make more physical sense since thermal conductivity of carbon fiber mat is much higher than that of fiberglass mat.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Effect of Fiber Volume Fraction on Thermal Conductivity of a Woven-Mat Composite Lamina Available to Purchase
Hossein Golestanian
Hossein Golestanian
University of Shahr-E-Kord, Shahr-E-Kord, Iran
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Hossein Golestanian
University of Shahr-E-Kord, Shahr-E-Kord, Iran
Paper No:
HT2005-72356, pp. 137-144; 8 pages
Published Online:
March 9, 2009
Citation
Golestanian, H. "Effect of Fiber Volume Fraction on Thermal Conductivity of a Woven-Mat Composite Lamina." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 137-144. ASME. https://doi.org/10.1115/HT2005-72356
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