The paper describes two- and three-dimensional computer simulations which are used to study fundamental flow and thermal phenomena in multilouvered fins used for air-side heat transfer enhancement in compact heat exchangers. Results pertaining to flow transition, thermal wake interference, and fintube junction effects are presented. It is shown that a Reynolds number based on flow path rather than louver pitch is more appropriate in defining the onset of transition, and characteristic frequencies in the louver bank scale better with a global length scale such as fin pitch than with louver pitch or thickness. With the aid of computer experiments, the effect of thermal wakes is quantified on the heat capacity of the fin as well as the heat transfer coefficient, and it is established that experiments which neglect accounting for thermal wakes can introduce large errors in the measurement of heat transfer coefficients. Further, it is shown that the geometry of the louver in the vicinity of the tube surface has a large effect on tube heat transfer and can have a substantial impact on the overall heat capacity.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Computational Insights Into Air-Side Flow and Heat Transfer in Compact Heat Exchangers Available to Purchase
D. K. Tafti
D. K. Tafti
Virginia Polytechnic Institute and State University, Blacksburg, VA
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D. K. Tafti
Virginia Polytechnic Institute and State University, Blacksburg, VA
Paper No:
HT2005-72846, pp. 847-857; 11 pages
Published Online:
March 9, 2009
Citation
Tafti, DK. "Computational Insights Into Air-Side Flow and Heat Transfer in Compact Heat Exchangers." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 847-857. ASME. https://doi.org/10.1115/HT2005-72846
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