A visualization study of pool boiling at atmospheric pressure from plain and enhanced structures was conducted with PF 5060 as working fluid. The single layer enhanced structures were fabricated in copper and were 1 mm thick. The parameters investigated in the present study are heat flux, width of microchannels and overall structure width. A monochrome CCD camera with attached magnifying lens served as the main tool for observation of the boiling process from the structures. The nucleate boiling regime for a plain surface is usually divided into two sub-regimes: the isolated bubbles regime and the coalesced bubbles regime. For enhanced structures, the increase in geometric complexity leads to different flow regimes that may establish under different heat fluxes. This study evaluates these regimes using movies and still photographs. A comparison with the plain case is made and the differences highlighted.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Visualization of Pool Boiling From Plain and Enhanced Structures
Camil-Daniel Ghiu,
Camil-Daniel Ghiu
Georgia Institute of Technology, Atlanta, GA
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Yogendra K. Joshi
Yogendra K. Joshi
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Camil-Daniel Ghiu
Georgia Institute of Technology, Atlanta, GA
Yogendra K. Joshi
Georgia Institute of Technology, Atlanta, GA
Paper No:
HT2005-72609, pp. 737-744; 8 pages
Published Online:
March 9, 2009
Citation
Ghiu, C, & Joshi, YK. "Visualization of Pool Boiling From Plain and Enhanced Structures." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 737-744. ASME. https://doi.org/10.1115/HT2005-72609
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