Electro-hydrodynamic (EHD) enhancement of external condensation of refrigerant R-134a for a twenty-four tube bundle heat exchanger was studied experimentally. The tubes used in the bundle were state of the art enhanced tubes provided by a heat transfer tube manufacturer. Printed circuit board was used as the electrode and it was inserted between the tube columns to reduce the bundle effect. Different heat flux levels were tested, ranging from 10 to 20 kW/m2. The saturation temperature was 30°C and the applied electric field voltage ranged from 0 to 20 kV. The obtained test results indicated that PCB electrode worked effectively as the electrode in the tube bundle test and up to 31% enhancement was achieved. Comparison with single tube test showed that bundle was reduced to a satisfactory level.
Skip Nav Destination
ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger Available to Purchase
M. M. Ohadi,
M. M. Ohadi
University of Maryland, College Park, MD
Search for other works by this author on:
S. Dessiatoun,
S. Dessiatoun
University of Maryland, College Park, MD
Search for other works by this author on:
J. Qi
J. Qi
University of Maryland, College Park, MD
Search for other works by this author on:
J. Wu
University of Maryland, College Park, MD
M. M. Ohadi
University of Maryland, College Park, MD
S. Dessiatoun
University of Maryland, College Park, MD
J. Qi
University of Maryland, College Park, MD
Paper No:
HT2005-72832, pp. 589-592; 4 pages
Published Online:
March 9, 2009
Citation
Wu, J, Ohadi, MM, Dessiatoun, S, & Qi, J. "Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 589-592. ASME. https://doi.org/10.1115/HT2005-72832
Download citation file:
14
Views
Related Proceedings Papers
Related Articles
Augmentation of Thin Falling-Film Evaporation on Horizontal Tubes Using an Applied Electric Field
J. Heat Transfer (May,2000)
Falling Film and Spray Evaporation Enhancement Using an Applied Electric Field
J. Heat Transfer (November,2000)
Related Chapters
Techniques to Reduce Exchanger or System Cost
Heat Exchanger Engineering Techniques
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment