In this paper, the analytical and computational results are presented for a large-scale ceramic-tiles drying kiln. A lumped-parameter model was initially derived for the drying process of the kiln. This has led to the development of mathematical models for the energy conservation and convective heat and mass transfer drying process. Diffusion on the boundary layers of the tiles was also derived based on the basis of moisture isotherm, drying curve and different temperature profiles. This also takes into consideration the internal moisture transportation. The developed partial differential equations were discretized using the central-difference approximation method, which were further verified by a computational fluid-dynamics solver and the Gauss-Siedel iterative method. The modelling and simulations performed on the partial differential equations give possible auxiliary energy conservation and improvement on the drying process of the kiln.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Heat Transfer and Computational Simulations on the Drying Process of a Kiln
Almon Chai,
Almon Chai
Universiti Malaysia Sarawak, Sarawak, Malaysia
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Andrew Rigit,
Andrew Rigit
Universiti Malaysia Sarawak, Sarawak, Malaysia
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Ha How Ung
Ha How Ung
Swinburne University of Technology – Sarawak, Sarawak, Malaysia
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Almon Chai
Universiti Malaysia Sarawak, Sarawak, Malaysia
Andrew Rigit
Universiti Malaysia Sarawak, Sarawak, Malaysia
Ha How Ung
Swinburne University of Technology – Sarawak, Sarawak, Malaysia
Paper No:
HT2005-72799, pp. 583-588; 6 pages
Published Online:
March 9, 2009
Citation
Chai, A, Rigit, A, & Ung, HH. "Heat Transfer and Computational Simulations on the Drying Process of a Kiln." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 583-588. ASME. https://doi.org/10.1115/HT2005-72799
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