In this study we investigated numerically simultaneous heat and mass transfer during evaporation/condensation on the surface of a stagnant droplet in the presence of inert admixtures containing non-condensable solvable gas. The performed analysis is pertinent to slow droplet evaporation/condensation when Mach number is small (M≪1). The system of transient conjugate nonlinear energy and mass conservation equations was solved using anelastic approximation. Transport coefficients of the gaseous phase were calculated as functions of temperature and concentrations of gaseous species. Thermophysical properties of the liquid phase are assumed to be constant. Using the material balance at the droplet surface we obtained equations for Stefan velocity and the rate of change of the droplet radius taking into account the effect of solvable gas absorption at the gas-liquid interface. We derived also boundary conditions at gas-liquid interface taking into account the effect of gas absorption. The governing equations were solved using a method of lines. Numerical calculations showed essential change of the rates of heat and mass transfer in water droplet-air-water vapor system under the influence of solvable species in a gaseous phase. Consequently, the use of additives of solvable noncondensable gases to enhance the rate of heat and mass transfer in dispersed systems allows to increase the efficiency and reduce the size of gas-liquid contactors.
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Simultaneous Heat and Mass Transfer During Evaporation/Condensation on the Surface of a Stagnant Droplet in the Presence of Inert Admixtures Containing Non-Condensable Solvable Gas
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Elperin, T, Fominykh, A, & Krasovitov, B. "Simultaneous Heat and Mass Transfer During Evaporation/Condensation on the Surface of a Stagnant Droplet in the Presence of Inert Admixtures Containing Non-Condensable Solvable Gas." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 499-506. ASME. https://doi.org/10.1115/HT2005-72493
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