A detailed theoretical analysis has been carried out to study efficient heating of 1D composite dielectric samples due to microwaves. Current study involves processing of beef with oil layers with/without support and three cases are considered where oil layer is followed by beef layer (case 1), beef layer is followed by oil layer (case 2) and oil-beef layers are exposed to microwaves at both the sides (case 3). For cases 1 and 2, microwaves are incident at the left face only and the support is generally attached with the oil layer. A preliminary analysis has been carried out for beef-oil composite without any support for all cases and it is observed that identical average power in beef sample occurs for small thickness of oil layer irrespective of either oil or beef directly exposed to microwaves (case 1 or 2) and for greater thicknesses of oil layer, the food composite would exhibit greater average power for case 1. The maxima in average power corresponding to resonances occur at various sample thicknesses for all cases with and without supports and two dominant resonance modes R1 and R2 are considered where the average power at R1 mode is greater than that at R2 mode for all cases. The detailed spatial distribution for various cases illustrates that for small oil thicknesses, heating rate is less and greater heating rate would correspond to larger oil thicknesses. However, the excessive heating in beef sample may correspond to thermal runaway which are also illustrated by ΔTb (difference between the maximum and minimum values of temperature) in beef samples vs time plot. The similar analysis has been extended for all cases with oil layer directly attached with ceramic supports (Al2O3 and SiC). Based on the detailed analysis, the suitability of the support would be guided by factors such as optimal oil thickness, uniform heating and enhanced thermal processing within the beef sample.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Analysis of Microwave Heating for Composite Dielectric Food Substances Supported on Ceramic Materials
Tanmay Basak,
Tanmay Basak
Indian Institute of Technology – Madras, Chennai, India
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A. Meenakshi
A. Meenakshi
Indian Institute of Technology – Madras, Chennai, India
Search for other works by this author on:
Tanmay Basak
Indian Institute of Technology – Madras, Chennai, India
A. Meenakshi
Indian Institute of Technology – Madras, Chennai, India
Paper No:
HT2005-72311, pp. 421-430; 10 pages
Published Online:
March 9, 2009
Citation
Basak, T, & Meenakshi, A. "Analysis of Microwave Heating for Composite Dielectric Food Substances Supported on Ceramic Materials." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 421-430. ASME. https://doi.org/10.1115/HT2005-72311
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