The enthalpy-porosity technique is used in this study for numerical modeling of solidification of water and binary mixture of ammonium chloride and water (NH4Cl-H2O). A two-dimensional geometry was used to simulate the solidification process in the rectangular and trapezoidal cavities. The liquid fraction is computed based on an enthalpy balance. The mushy zone is modeled as pseudo-porous medium in which the porosity decreases from 1 (liquid) to 0 (solid) as the material solidifies. The solidification with single side cooled wall as well as both cooled side walls was investigated. The frozen layer thickness, the convective flow patterns, and the temperature distribution were obtained. The results obtained in the course of the study showed that the shape of the solid region and the convection pattern in the melt region compare well with experimental data obtained by Particle Image Velocimetry technique. The enthalpy-porosity model is predicting well the flow pattern and the thickness of the frozen layer.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Numerical Modeling of Solidification Process Using the Enthalpy-Porosity Technique
S. Kulkarni,
S. Kulkarni
Florida International University, Miami, FL
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C. X. Lin,
C. X. Lin
Florida International University, Miami, FL
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C. Ghenai
C. Ghenai
Florida International University, Miami, FL
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S. Kulkarni
Florida International University, Miami, FL
C. X. Lin
Florida International University, Miami, FL
C. Ghenai
Florida International University, Miami, FL
Paper No:
HT2005-72152, pp. 401-407; 7 pages
Published Online:
March 9, 2009
Citation
Kulkarni, S, Lin, CX, & Ghenai, C. "Numerical Modeling of Solidification Process Using the Enthalpy-Porosity Technique." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 401-407. ASME. https://doi.org/10.1115/HT2005-72152
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