The design of a two phase heat exchanger requires a fundamental knowledge of the parameters affecting film condensation. The interaction of roughened surfaces and change of surface energy by the addition of a surfactant to the system for quiescent steam was examined in this study. Three types of roughened surfaces were generated by roughening a polished surface with sandpaper, electroplating to obtain a thin porous coating of nodules onto the condenser surface, and soldering of porous aluminum foam to the condenser face. The addition of a nonionic surfactant, alcohol alkoxylate, to the system was evaluated for the roughened surfaces. For a Reynolds number less than 50, the roughened surfaces examined all degraded the condensation heat transfer. The addition of a surfactant to the system enhanced condensation heat transfer on polished surfaces almost two fold.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Effects of Surface Roughness and Surfactant on Film Condensation Heat Transfer of Steam
Andrew T. Morrison,
Andrew T. Morrison
University of Texas at Arlington, Arlington, TX
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S. M. Kwark,
S. M. Kwark
University of Texas at Arlington, Arlington, TX
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S. M. You
S. M. You
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Andrew T. Morrison
University of Texas at Arlington, Arlington, TX
S. M. Kwark
University of Texas at Arlington, Arlington, TX
S. M. You
University of Texas at Arlington, Arlington, TX
Paper No:
HT2005-72154, pp. 261-270; 10 pages
Published Online:
March 9, 2009
Citation
Morrison, AT, Kwark, SM, & You, SM. "Effects of Surface Roughness and Surfactant on Film Condensation Heat Transfer of Steam." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 261-270. ASME. https://doi.org/10.1115/HT2005-72154
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