In this paper, both nucleus formation and bubble growth during boiling in microchannels were investigated. A series of visualized experiments were conducted to observe the boiling nucleation and bubble dynamics restricted within parallel microchannels on a silicon wafer. The channels were rectangular and had selected length scale ranging from 50 to 100 microns. A high-speed CCD camera was employed together with a microscope to dynamically record the boiling images. The rates of bubble growth were measured in the channels. The phase change nucleus formation theory was used to determine the initial position of the bubble. The bubble growth rate was described by two ordinary differential equations deduced from the microlayer evaporation theory. The calculation and experimental results were reasonably coincided.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Characteristics of Nucleation and Bubble Growth During Microscale Boiling Available to Purchase
Jiang-Tao Liu,
Jiang-Tao Liu
Tsinghua University, Beijing, China
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Xiao-Feng Peng
Xiao-Feng Peng
Tsinghua University, Beijing, China
Search for other works by this author on:
Yong Tian
Tsinghua University, Beijing, China
Jiang-Tao Liu
Tsinghua University, Beijing, China
Xiao-Feng Peng
Tsinghua University, Beijing, China
Paper No:
HT2005-72723, pp. 225-231; 7 pages
Published Online:
March 9, 2009
Citation
Tian, Y, Liu, J, & Peng, X. "Characteristics of Nucleation and Bubble Growth During Microscale Boiling." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 225-231. ASME. https://doi.org/10.1115/HT2005-72723
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