Transient heat transfer experiments were performed in a model of a multi-pass gas turbine blade cooling circuit. The inner surface of the Plexiglas model was coated with thermochromic liquid crystals in order to determine the internal heat transfer coefficients. A change in inlet temperature is applied using a pre-cooled heat exchanger. As for simple geometries the analytical solution of Fourier’s equation can often be directly used for data evaluation, one ought to pay attention to complex passages. The reason has to be seen that the flow in complex passages has to be characterized by local and time dependent fluid temperatures. As a direct consequence data evaluation might be limited to small evaluation areas especially far downstream. Otherwise the uncertainties in the heat transfer results will increase substantially. In the present study the sensitivity of the transient method for complex passages has been analyzed theoretically and applied experimentally.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Transient Heat Transfer Experiments in Complex Passages
Rico Poser,
Rico Poser
University of Stuttgart, Stuttgart, Germany
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Jens von Wolfersdorf,
Jens von Wolfersdorf
University of Stuttgart, Stuttgart, Germany
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Klaus Semmler
Klaus Semmler
MTU Aero Engines GmbH, Munich, Germany
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Rico Poser
University of Stuttgart, Stuttgart, Germany
Jens von Wolfersdorf
University of Stuttgart, Stuttgart, Germany
Klaus Semmler
MTU Aero Engines GmbH, Munich, Germany
Paper No:
HT2005-72260, pp. 797-804; 8 pages
Published Online:
March 9, 2009
Citation
Poser, R, von Wolfersdorf, J, & Semmler, K. "Transient Heat Transfer Experiments in Complex Passages." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 797-804. ASME. https://doi.org/10.1115/HT2005-72260
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