For the purpose of decomposing the processing gases CF4 from semiconductor manufacturers, ceramic honeycomb regenerative burner system is suggested by using the principle of HTAC. A simulated high temperature air combustion furnace has been used to determine the features of HTAC flames and the results of the decomposition of CF4. The preheat air temperature of it is above 900 °C. The exhaust gas released into the atmosphere is lower than 150 °C. Moreover, the efficiency of recovery of waste heat is higher than 70%, the NOx level in exhaust gas is less than 300 mg/m3 and the distribution of temperature in the furnace is nearly uniform. The factors influencing heat transfer, temperature profile in chamber and NOx emission were discussed. Also some CF4 can be decomposed in this system. Experimental results indicated that the destruction removal efficiency (DRE) of CF4 increases with the increasing of concentration of H2O in some scale, and will not keep climbing when the concentration reach a point. DRE of CF4 decreases with the decreasing of concentration of CF4 under condition of other factors unchanged.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
The Experimental Study on High Temperature Air Combustion and CF4 Decomposition Available to Purchase
L. Jia
Beijing Jiaotong University, Beijing, China
S. Ma
Beijing Jiaotong University, Beijing, China
Paper No:
HT2005-72440, pp. 705-708; 4 pages
Published Online:
March 9, 2009
Citation
Jia, L, & Ma, S. "The Experimental Study on High Temperature Air Combustion and CF4 Decomposition." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 705-708. ASME. https://doi.org/10.1115/HT2005-72440
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