We study the convective heat transport phenomenon of liquid in a nanoscale straight channel by performing the non-equilibrium molecular dynamics simulation (NEMD). Fundamental heat transfer phenomenon distinctive in a nanoscale is reported by Han and Lee [Phys. Rev. E 70, 061205 (2004)]. It is the significant heat transfer in the upstream direction even in the absence of temperature gradient in the direction. A planar Poiseuille flow is considered in the simulation, where liquid argon in a straight channel of Pt atoms is driven by a gravity-like body force. The intermolecular force and plane peculiar velocity mainly induces the heat transfer, which becomes significant when the velocity gradient is sizable in the range of the intermolecular force. While the simulation results agree well with the prediction by Navier-Stokes (NS) equation and Fourier’s law, the heat transfer remains of a significant amount. The heat transfer depends on the velocity gradient in a nonlinear fashion, which can not be accounted for the third order generalized Fourier’s law in the literature.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Molecular Dynamics Simulation Study of Convective Heat Transport in a Nanoscale Channel Available to Purchase
Minsub Han,
Minsub Han
Seoul National University, Seoul, Korea
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Joon Sik Lee,
Joon Sik Lee
Seoul National University, Seoul, Korea
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Seungho Park
Seungho Park
Hongik University, Seoul, Korea
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Minsub Han
Seoul National University, Seoul, Korea
Joon Sik Lee
Seoul National University, Seoul, Korea
Seungho Park
Hongik University, Seoul, Korea
Paper No:
HT2005-72477, pp. 427-432; 6 pages
Published Online:
March 9, 2009
Citation
Han, M, Lee, JS, & Park, S. "Molecular Dynamics Simulation Study of Convective Heat Transport in a Nanoscale Channel." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 427-432. ASME. https://doi.org/10.1115/HT2005-72477
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