A Non Equilibrium Molecular Dynamics (NEMD) simulation has been used to calculate the temperature distribution in the substrate side of a nanometer scale point contact on a planar silicon substrate with different doping concentrations and contact radii. The size of the non-uniform temperature zone was found to approach the average nearest-neighbor distance of impurity dopants when the contact radius was reduced below this distance. At a contact radius of 0.5 nm, the calculated spreading thermal resistance at the nano-point contact agrees with those obtained using two phonon transport models. At a contact radius between 1 nm and 6 nm, however, the spreading resistance from the NEMD is much larger than those from the two models that assume small deviation from the equilibrium distribution.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Molecular Dynamics Simulation of Thermal Transport at Nanometer Size Point Contacts on a Planar Silicon Substrate Available to Purchase
Sanjoy Saha,
Sanjoy Saha
University of Texas at Austin, Austin, TX
Search for other works by this author on:
Li Shi
Li Shi
University of Texas at Austin, Austin, TX
Search for other works by this author on:
Sanjoy Saha
University of Texas at Austin, Austin, TX
Li Shi
University of Texas at Austin, Austin, TX
Paper No:
HT2005-72308, pp. 389-396; 8 pages
Published Online:
March 9, 2009
Citation
Saha, S, & Shi, L. "Molecular Dynamics Simulation of Thermal Transport at Nanometer Size Point Contacts on a Planar Silicon Substrate." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 389-396. ASME. https://doi.org/10.1115/HT2005-72308
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