The three important length scales in composites made from nano/micro wires and fibers are: 1) the ratio of inter fiber distance and mean free path of the phonons in the host medium 2) the ratio of the diameter of the fiber or the wire and the mean free path of the phonons in the host medium and 3) the ratio of the diameter of the fiber and the mean free path of phonons in the fiber. Modeling of longitudinal thermal conductivity of two-dimensional nano and micro composites has not been attempted in the literature. This paper develops analytical modeling for the longitudinal thermal conductivity of nano and micro composites by solving the Boltzmann transport equation (BTE) for phonons. The paper shows the scattering of phonons in the host medium by the fiber boundaries play a very important role in deciding the thermal conductivity of nano and micro composites. The model is in good agreement with data on thermal diffusivity of Bismuth Telluride nanowire/ Alumina composite.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Modeling of Phonon Thermal Conductivity of Two Dimensional Nano and Micro Composites in the Longitudinal Direction
Ravi Prasher
Ravi Prasher
Intel Corporation, Chandler, AZ
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Ravi Prasher
Intel Corporation, Chandler, AZ
Paper No:
HT2005-72116, pp. 359-363; 5 pages
Published Online:
March 9, 2009
Citation
Prasher, R. "Modeling of Phonon Thermal Conductivity of Two Dimensional Nano and Micro Composites in the Longitudinal Direction." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 359-363. ASME. https://doi.org/10.1115/HT2005-72116
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